Multi-chip modules (MCMs) allow high-density integration of a number of bare and/or packaged semiconductor devices, with interconnect handled within a single high-reliability module.
MCM technology is applicable to many markets. Substrate technology includes: Thick Film ceramic, LTCC, Thin Film and for benign environments, epoxy laminates, such as FR4. For the harshest environments, chip and wire MCMs on ceramic are hermetically sealed in metal or ceramic packages. For lower cost applications, epoxy or silicone glob top is often used to provide protection of wire bonding or flip-chip assemblies.
The benefits of this modular approach are cost, high speed and the portability of a 'plug-and-play' system that can be attached directly to the motherboard. A key advantage is the elimination of non-value-added packaging and interconnection of bare die - which can add a factor of as much as 100x to the size of the actual functional areas of active and passive components.
Related links:
COB (chip on board)
Other packaging technologies
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