Clean room facilities: Class 100,000 down to Class 100
High-reliability circuits for military and professional applications are manufactured under strict clean room conditions. Standard thick-film hybrid manufacture, assembly and test are conducted in appropriately classified environments, while specialised technologies such as photo-defined thick-film substrates, are fabricated in Class 100 conditions. Assembly techniques include substrate attachment, bare die mounting, automatic and manual wire bonding of gold and aluminium wire.
Packages are then sealed in a dry nitrogen atmosphere using resistance, projection or laser welding equipment. The hermetic integrity of the completed package is tested using both fine and gross leak test methods. Further environmental screening and testing over extremes of temperature is performed as the circuit specification requires.
Substrates
Packaging
Optoelectronics
Assembly
RF & microwave
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